Fraunhofer IZM ASSID

Fraunhofer IZM’s “All Silicon System Integration Center Dresden” (ASSID), established in 2010, is an integral part of Fraunhofer IZM, specializing in 3D wafer-level system integration and packaging. ASSID operates a state-of-the-art 300mm process line based on Cu-Through Silicon Via (TSV) technology, offering tailored development and manufacturing of complex 3D systems.